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Celcon® GC25TF
乙缩醛（POM）共聚物
Ticona
产品说明
Celcon® GC25TF is a 25% glass coupled acetal copolymer formulated for higher flow in thin walled and small parts. Celcon GC25TF is also exceptionally resistant to fuel. It offers excellent resistance to transportation fuels especially oxygenated fuels.
Chemical abbreviation according to ISO 1043-1: POM
总体
材料状态 • 已商用：当前有效
供货地区 • 北美洲 • 拉丁美洲 • 南美洲
填料/增强材料 • 玻璃纤维增强材料, 25% 填料按重量
性能特点 • 共聚物 • 流动性高
• 化学耦合 • 耐油
用途 • 薄壁部件
RoHS 合规性 • 联系制造商
形式 • 颗粒料
加工方法 • 注射成型
树脂ID (ISO 1043) • POM
物理性能
比重
收缩率
流动
横向流动
吸水率 饱和, 23°C
平衡, 23°C, 50% RH
机械性能
拉伸模量
抗张强度 屈服, 23°C
断裂
拉伸应变 (断裂)
弯曲模量
23°C
23°C
冲击性能 简支梁缺口冲击强度 (23°C)
悬壁梁缺口冲击强度
23°C
23°C
热性能
热变形温度
1.8 MPa, 未退火
1.8 MPa, 未退火
维卡软化温度
熔融温度
额定值单位制 测试方法
1.58g/cm³ ASTM D792
ISO 1183
ASTM D955
0.40%
1.0%
ISO 62
0.80%
0.20%
额定值单位制 测试方法
8720MPa ISO 527-2/1A/1
117MPa ASTM D638
120MPa ISO 527-2/1A/5
2.0% ISO 527-2/1A/5
ISO 527-2/1A/50
8270MPa ASTM D790
8710MPa ISO 178
额定值单位制 测试方法
6.4kJ/m² ISO 179/1eA
69J/m ASTM D256
6.4kJ/m² ISO 180/1A
额定值单位制 测试方法
118°C ASTM D648
162°C ISO 75-2/A
161°C ISO 306/B50
-- 2 165°C ISO 11357-3
-- 166°C ASTM D3418
线形膨胀系数 ISO 11359-2
流动 0.000030cm/cm/°C
横向 0.00010cm/cm/°C
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Celcon® GC25TF 2012年10月14日
乙缩醛（POM）共聚物
Ticona
注射 额定值单位制
加工（熔体）温度 182 到 199°C
模具温度 93.0 到 121°C
注射说明
Standard reciprocating screw injection molding machines with a high compression screw (minimum 3:1 and preferably 4:1) and low back pressure (0.35 Mpa/50 PSI) are favored. Using a low compression screw (i.e.- general purpose 2:1 compression ratio) can result in unmelted particles and poor melt homogeneity. Using a high back pressure to make up for a low compression ratio may lead to excessive shear heating and deterioration of the Celcon material.
Melt temperature: preferred range 182-199 C (360-390 F) Melt temperature should never exceed 230 C (450 F).Mold surface temperature: preferred range 93-121 C (200-250 F) especially with wall thickness less than 1.5 mm (0.060 in.). May require mold temperature as high as 120 C (250 F) to reproduce mold surface or to assure minimal molded in stress. Wall thickness greater than 3 mm (1/8 in.) may use a cooler (65 C/150 F) mold surface temperature and wall thickness over 6 mm (1/4 in.) may use a cold mold surface down to 25 C (80 F). In general, mold surface temperatures lower than 82 C (180 F) may produce a hazy surface or a surface with flow lines, pits and other included defects.
备注
1 一般属性：这些不能被视为规格。
2 10°C/min
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